IEC 60749-10:2022
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
27-04-2022
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IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.
This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition:
- covers both unattached components and components attached to printed wiring boards;
- tolerance limits modified for peak acceleration and pulse duration;
- mathematical formulae added for velocity change and equivalent drop height.
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| CEI EN IEC 60749-10:2022 | Identical |
| PN-EN IEC 60749-10:2023-01 | Identical |
| NF EN IEC 60749-10:2022 | Identical |
| I.S. EN IEC 60749-10:2022 | Identical |
| SS-EN IEC 60749-10, UTG 2:2022 | Identical |
| UNE-EN IEC 60749-10:2022 | Identical |
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