IEC 60749-19:2003
NA
NA
Status of Standard is Unknown
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Amended by
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Published date
13-02-2003
Publisher
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.
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