• IEC 60749-19:2003/AMD1:2010

    NA Status of Standard is Unknown

    Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English, English - French, Spanish, Castilian

    Published date:  28-07-2010

    Publisher:  International Electrotechnical Committee

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