IEC 60749-19:2003+AMD1:2010 CSV
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Hardcopy , PDF
English, English - French
29-11-2010
Foreword
1 Scope
2 Description of the test apparatus
3 Test method
4 Failure criteria
5 Requirements
6 Categories of separation
7 Summary
IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC 60749. (03/2008) Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 60749-19 : 2003 AMD 1 2011 | Identical |
| NEN EN IEC 60749-19 : 2003 AMD 1 2010 | Identical |
| I.S. EN 60749-19:2003 | Identical |
| PN EN 60749-19 : 2005 AMD 1 2010 | Identical |
| DIN EN 60749-19:2011-01 | Identical |
| BS EN 60749-19 : 2003 | Identical |
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