IEC 60749-23:2025 RLV
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
Hardcopy , PDF
English
09-12-2025
IEC 60749-23:2025 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 60749-23:2025 specifies the test used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", can be used to screen for infant-mortality related failures. The detailed use and application of burn-in is outside the scope of this document.
This edition includes the following significant technical changes with respect to the previous edition:
a) absolute stress test definitions and resultant test durations have been updated.
| Committee |
TC 47
|
| DocumentType |
Redline
|
| Pages |
29
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
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