IEC 60749-23:2004+AMD1:2011 CSV
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
Hardcopy , PDF
English, English - French
30-03-2011
09-12-2025
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
6 Cool-down
7 Measurements
8 Failure criteria
9 Summary
IEC 60749-23:2004+A1:2011 is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this standard. This consolidated version consists of the first edition (2004) and its amendment 1 (2011). Therefore, no need to order amendment in addition to this publication.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC PAS 62189. (08/2004) Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| NF EN 60749-23 : 2004 AMD 1 2012 | Identical |
| NEN EN IEC 60749-23 : 2004 AMD 1 2011 | Identical |
| I.S. EN 60749-23:2004 | Identical |
| PN EN 60749-23 : 2006 AMD 1 2011 | Identical |
| BS EN 60749-23 : 2004 | Identical |
| DIN EN 60749-23:2011-07 | Identical |
| UNE-EN 60749-23:2005 | Identical |
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