IEC 60749-30:2020
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
Hardcopy , PDF
English - French
17-08-2020
IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3;
- expansion of 6.7 on solder reflow;
- inclusion of explanatory notes and clarifications.
| Committee |
TC 47
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-8669-2
|
| Pages |
0
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| OVE EN IEC 60749-30:2023 03 01 | Identical |
| I.S. EN IEC 60749-30:2020 | Identical |
| EN IEC 60749-30:2020 | Identical |
| PN-EN IEC 60749-30:2021-05 | Identical |
| NF EN IEC 60749-30:2020 | Identical |
| DS/EN IEC 60749-30:2020 | Identical |
| CEI EN IEC 60749-30:2021-06 | Identical |
| UNE-EN IEC 60749-30:2020 | Identical |
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