IEC 60749-37:2022 RLV
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English
12-10-2022
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IEC 60749-37:2022 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition:
- correction of a previous technical error concerning test conditions;
- updates to reflect improvements in technology.
| DocumentType |
Redline
|
| Pages |
67
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
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