IEC 60749-37:2008

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test apparatus and components
  4.1 Test apparatus
  4.2 Test components
  4.3 Test board
  4.4 Test board assembly
  4.5 Number of components and sample size
5 Test procedure
  5.1 Test equipment and parameters
  5.2 Pre-test characterization
  5.3 Drop testing
6 Failure criteria and failure analysis
7 Summary
Annex A (informative) Preferred board construction,
        material, design and layout
Bibliography

Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.