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  • IEC 60749-37:2008

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  12-10-2022

    Language(s):  English - French

    Published date:  30-01-2008

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope and object
    2 Normative references
    3 Terms and definitions
    4 Test apparatus and components
      4.1 Test apparatus
      4.2 Test components
      4.3 Test board
      4.4 Test board assembly
      4.5 Number of components and sample size
    5 Test procedure
      5.1 Test equipment and parameters
      5.2 Pre-test characterization
      5.3 Drop testing
    6 Failure criteria and failure analysis
    7 Summary
    Annex A (informative) Preferred board construction,
            material, design and layout
    Bibliography

    Abstract - (Show below) - (Hide below)

    Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47
    Development Note Supersedes IEC PAS 62050. (02/2008) Stability Date: 2021. (11/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    04/30119207 DC : DRAFT AUG 2004 IEC 60747-20-1 - SEMICONDUCTOR DEVICES - PART 20-1: HANDLING, PACKING, LABELLING, SHIPPING AND USE OF MOISTURE REFLOW SENSITIVE SURFACE MOUNT DEVICES
    I.S. EN 60749-40:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE
    EN 60749-20-1 : 2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
    EN 60749-40 : 2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE
    09/30190356 DC : 0 BS EN 60749-40 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE
    BS EN 60749-40:2011 Semiconductor devices. Mechanical and climatic test methods Board level drop test method using a strain gauge
    IEC 60749-40:2011 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
    CEI EN 60749-40 : 2012 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE
    BS EN 60749-20-1:2009 Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
    NF EN 60749-40 : 2012 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE
    I.S. EN 60749-20-1:2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
    IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
    IEC 60749-40:2011 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
    IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
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