IEC 61189-3-719:2016
Current
The latest, up-to-date edition.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
05-01-2016
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test specimens
5 Test apparatus
6 Procedure
7 Report
8 Additional information
Bibliography
IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
| Committee |
TC 91
|
| DevelopmentNote |
Stability date: 2020. (01/2016)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61189-3-719 : 2016 | Identical |
| NBN EN 61189-3-719 : 2016 | Identical |
| NEN EN IEC 61189-3-719 : 2016 | Identical |
| PN EN 61189-3-719 : 2016 | Identical |
| SN EN 61189-3-719 : 2016 | Identical |
| BS EN 61189-3-719:2016 | Identical |
| CEI EN 61189-3-719 : 2016 | Identical |
| EN 61189-3-719:2016 | Identical |
| DIN EN 61189-3-719:2014-04 (Draft) | Identical |
| UNE-EN 61189-3-719:2016 | Identical |
| PNE-FprEN 61189-3-719 | Identical |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
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