IEC 61189-3-913:2016
Current
The latest, up-to-date edition.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
05-01-2016
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Pre-conditioning
5 Test methods
Annex A (normative) - Boards and panels
Annex B (normative) - Equilibrium test
Bibliography
IEC 61189-3-913:2016 specifies the test methods for thermal conductivity specific to printed circuit boards for high-brightness LEDs. The test applies to printed circuit boards for high-brightness LEDs with surface mounted LEDs or with device embedded LEDs in electronic control devices (ECDs). This first edition cancels and replaces the first edition of IEC PAS 61189-3-913 published in 2011. This edition constitutes a technical revision. This edition focused only on the test methods for thermal conductivity specific to printed circuit boards for high-brightness LEDs.
Committee |
TC 91
|
DevelopmentNote |
Supersedes IEC PAS 61189-3-913. Stability date: 2020. (01/2016)
|
DocumentType |
Standard
|
Pages |
57
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Supersedes |
Standards | Relationship |
PNE-FprEN 61189-3-913 | Identical |
I.S. EN 62326-20:2016 | PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS |
IEC 62326-20:2016 | Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
BS EN 62326-20:2016 | Printed boards Printed circuit boards for high-brightness LEDs |
IEC TR 61189-3-914:2017 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines |
PD IEC/TR 61189-3-914:2017 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines |
EN 62326-20:2016 | Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
IEC PAS 62326-20:2011 | Printed boards - Part 20: Electronic circuit board for high-brightness LEDs |
IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
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