IEC 61191-3:1998
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
12-09-2022
English - French
28-08-1998
Important note : Users cannot be edited or removed once added to your Multi user PDF.Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
| Committee |
TC 91
|
| DocumentType |
Standard
|
| Pages |
31
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| UNE-EN 61191-3:1998 | Identical |
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