IEC 61191-3:2017
Current
The latest, up-to-date edition.
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Hardcopy , PDF
English - French, English
30-05-2017
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Through-hole mounting of components
6 Acceptance requirements
7 Rework of unsatisfactory solder connections
Annex A (normative) - Placement requirements for
through-hole mount devices
Bibliography
IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.
| Committee |
TC 91
|
| DevelopmentNote |
Stability Date: 2024. (06/2017)
|
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NEN EN IEC 61191-3 : 2017 | Identical |
| PN EN 61191-3 : 2017 | Identical |
| BS EN 61191-3:2017 | Identical |
| EN 61191-3:2017 | Identical |
| JIS C 61191-3:2020 | Identical |
| I.S. EN 61191-3:2017 | Equivalent |
| DIN EN 61191-3:2016-01 (Draft) | Identical |
| UNE-EN 61191-3:2017 | Identical |
| GOST R IEC 61191-3 : 2010 | Identical |
| I.S. EN 61191-3:2017 | Identical |
| BS EN 50377-8-5:2007 | Identical |
| NF EN 61191-3 : 2000 | Identical |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : Users cannot be edited or removed once added to your Multi user PDF.