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  • IEC 61191-3:1998

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    Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  12-09-2022

    Language(s):  English - French

    Published date:  28-08-1998

    Publisher:  International Electrotechnical Committee

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    Abstract - (Show below) - (Hide below)

    Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

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    Committee TC 91
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By
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