IEC 61249-2-12:1999
Current
The latest, up-to-date edition.
Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, English - French, Spanish, Castilian
29-01-1999
FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad laminate
7 Non-electrical properties of the base material after
complete removal of the copper foil
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test method
numbers
Gives requirements for properties of epoxide non-woven aramid copper clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm.
Committee |
TC 91
|
DevelopmentNote |
Also numbered as BS EN 61249-2.12 (08/2004) Stability Date: 2018. (09/2017)
|
DocumentType |
Standard
|
Pages |
16
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Standards | Relationship |
NF EN 61249-2-12 : 2002 | Identical |
NFC 93 074 : 1996 PR | Identical |
NEN EN IEC 61249-2-12 : 1999 | Identical |
I.S. EN 61249-2-12:1999 | Identical |
PN EN 61249-2-12 : 2002 | Identical |
SN EN 61249-2-12 : 1999 | Identical |
EN 61249-2-12:1999 | Identical |
DIN EN 61249-2-12:1999-11 | Identical |
UNE-EN 61249-2-12:2001 | Identical |
IEC 62326-1:2002 | Printed boards - Part 1: Generic specification |
EN 62326-1:2002 | Printed boards - Part 1: Generic specification |
BS EN 62326-1:2002 | Printed boards Generic specification |
CEI EN 62326-1 : 2002 | PRINTED BOARDS - PART 1: GENERIC SPECIFICATION |
I.S. EN 62326-1:2002 | PRINTED BOARDS - GENERIC SPECIFICATION |
IEC 61249-5-1:1995 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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