IEC 61249-2-13:1999
Current
The latest, up-to-date edition.
Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
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English, English - French, Spanish, Castilian
26-02-1999
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FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad
laminate
7 Non-electrical properties of the base material
after complete removal of the copper foil
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test
method reference numbers
Gives requirements for properties of cyanate ester non-woven aramid copper-clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm.
| Committee |
TC 91
|
| DevelopmentNote |
Also numbered as BS EN 61249-2.13 (08/2004) Supersedes IEC 60249-2-13. (03/2008) Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 61249-2-13 : 2002 | Identical |
| NEN EN IEC 61249-2-13 : 1999 | Identical |
| I.S. EN 61249-2-13:1999 | Identical |
| PN EN 61249-2-13 : 2002 | Identical |
| SN EN 61249-2-13 : 1999 | Identical |
| EN 61249-2-13:1999 | Identical |
| DIN EN 61249-2-13:1999-11 | Identical |
| UNE-EN 61249-2-13:2001 | Identical |
| IEC 61249-5-1:1995 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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