• IEC 62047-5:2011

    Current The latest, up-to-date edition.

    Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

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    Published date:  13-07-2011

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Essential ratings and characteristics
    5 Measuring methods
    6 Reliability (performance)
    Annex A (informative) - General description of RF MEMS
                            Switches
    Annex B (informative) - Geometry of RF MEMS switches
    Annex C (informative) - Packaging of RF MEMS switches
    Annex D (informative) - Failure mechanism of RF MEMS switches
    Annex E (informative) - Applications of RF MEMS switches
    Annex F (informative) - Measurement procedure of RF MEMS
                            switches

    Abstract - (Show below) - (Hide below)

    IEC 62047-5:2011 describes terminology, definition, symbols, test methods that can be used to evaluate and determine the essential ratings and characteristic parameters of RF MEMS switches. The statements made in this standardization are also applicable to RF (Radio Frequency) MEMS (Micro-Electro-Mechanical Systems) switches with various structures, contacts (d.c. contact and capacitive contact), configurations (series and shunt), switching networks (SPST, SPDT, DPDT, etc.), and actuation mechanism such as electrostatic, electro-thermal, electromagnetic, piezoelectric, etc. The RF MEMS switches are promising devices in advanced mobile phones with multi-band/mode operation, smart radar systems, reconfigurable RF devices and systems, SDR (Software Defined Radio) phones, test equipments, tunable devices and systems, satellite, etc. The contents of the corrigendum of March 2012 have been included in this copy.

    General Product Information - (Show below) - (Hide below)

    Development Note Stability Date: 2018. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    14/30296894 DC : 0 BS EN 62830-1 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR DEVICES FOR ENERGY HARVESTING AND GENERATION - PART 1: VIBRATION BASED PIEZOELECTRIC ENERGY HARVESTING
    BS IEC 62830-3 : 2017 SEMICONDUCTOR DEVICES - SEMICONDUCTOR DEVICES FOR ENERGY HARVESTING AND GENERATION - PART 3: VIBRATION BASED ELECTROMAGNETIC ENERGY HARVESTING
    IEC 62830-3:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting
    17/30336994 DC : 0 BS IEC 62969-3 ED.1.0 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES - PART 3: SHOCK DRIVEN PIEZOELECTRIC ENERGY HARVESTING FOR AUTOMOTIVE VEHICLE SENSORS
    14/30301992 DC : 0 BS EN 62830-3 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR DEVICES FOR ENERGY HARVESTING AND GENERATION - PART 3: VIBRATION BASED ELECTROMAGNETIC ENERGY HARVESTING
    IEC 62830-1:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
    IEC 60749-27:2006+AMD1:2012 CSV Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
    IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 CSV Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
    IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
    IEC 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
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