IEC PAS 62050:2004
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Board level drop test method of components for handheld electronic products
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
30-01-2008
English
10-11-2004
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
Introduction
1 Scope
2 Apparatus
3 Terms and definitions
4 Applicable documents
5 Test Components and Board
6 Test Procedure
7 Failure criteria and failure analysis
8 Reporting
Annex A (informative) Recommended Testing Hardware
The Board Level Drop Test Method is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components while duplicating the failure modes normally observed during product level test.The purpose of this document is to prescribe a standardized test method and reporting procedure.
| DevelopmentNote |
Also numbered as EIA JESD 22-B111. (11/2004)
|
| DocumentType |
Miscellaneous Product
|
| Pages |
18
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| NEN NPR IEC/PAS 62050 : 2004 | Identical |
| DD IEC PAS 62050 : DRAFT 2004 | Identical |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC SM 782 : A1993 AMD 2 1999 | SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
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