IEC PAS 62190:2000

1 Purpose
2 Scope
3 Background
4 Applicable documents
5 Apparatus
   5.1 Temperature humidity chambers
   5.2 Solder Reflow Equipment
   5.3 Ovens
   5.4 Microscopes
   5.5 Cross-sectioning
   5.6 Electrical test
   5.7 Weighing apparatus (Optional)
6 Classification/reclassification
   6.1 Reclassification
7 Procedure
   7.1 Sample requirements
   7.2 Electrical test
   7.3 Initial inspection
   7.4 Bake
   7.5 Moisture soak
   7.6 Reflow
   7.7 External visual
   7.8 Electrical test
   7.9 Acoustic microscopy
8 Criteria
   8.1 Failure criteria
   8.2 Criteria requiring further evaluation
   8.3 Failure verification
9 Moisture/reflow sensitivity classification
10 Optional weight gain/loss analysis
   10.1 Weight gain
   10.2 Absorption curve
   10.3 Desorption curve
11 Additions and exceptions
Annex A - Classification flow
Table 1 - Package reflow conditions
Table 2 - Moisture sensitivity levels
Table 3 - Classification reflow profiles

Aims at identifying the classification level of nonhermetic solid state Surface Mount Devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation.