IEC PAS 62190:2000
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Moisture/reflow sensivity classification for nonhermetic solid state surface mount devices
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
17-10-2001
English
28-11-2000
Important note : Users cannot be edited or removed once added to your Multi user PDF.
1 Purpose
2 Scope
3 Background
4 Applicable documents
5 Apparatus
5.1 Temperature humidity chambers
5.2 Solder Reflow Equipment
5.3 Ovens
5.4 Microscopes
5.5 Cross-sectioning
5.6 Electrical test
5.7 Weighing apparatus (Optional)
6 Classification/reclassification
6.1 Reclassification
7 Procedure
7.1 Sample requirements
7.2 Electrical test
7.3 Initial inspection
7.4 Bake
7.5 Moisture soak
7.6 Reflow
7.7 External visual
7.8 Electrical test
7.9 Acoustic microscopy
8 Criteria
8.1 Failure criteria
8.2 Criteria requiring further evaluation
8.3 Failure verification
9 Moisture/reflow sensitivity classification
10 Optional weight gain/loss analysis
10.1 Weight gain
10.2 Absorption curve
10.3 Desorption curve
11 Additions and exceptions
Annex A - Classification flow
Table 1 - Package reflow conditions
Table 2 - Moisture sensitivity levels
Table 3 - Classification reflow profiles
Aims at identifying the classification level of nonhermetic solid state Surface Mount Devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation.
| DocumentType |
Miscellaneous Product
|
| Pages |
19
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| NEN NPR IEC/PAS 62190 : 2001 | Identical |
| IPC SM 786 : A1995 | PROCEDURES FOR CHARACTERIZING AND HANDLING OF MOISTURE/REFLOW SENSITIVE ICs |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC J STD 035 : 0 | ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS |
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