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  • IEC 60749:1996+AMD1:2000+AMD2:2001 CSV

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    Semiconductor devices - Mechanical and climatic test methods

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  19-08-2004

    Language(s):  English - French

    Published date:  10-04-2002

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    Chapter 1: General
    1 Scope and object
    2 Normative references
    3 Terms, definitions and letter symbols
    4 Standard atmospheric conditions
    5 External visual examination and verification of dimensions
    6 Electrical measurements
    Chapter 2: Mechanical Test Methods
    1 Robustness of terminations
       1.1 Tensile
       1.2 Bending
       1.3 Torsion
       1.4 Torque
    2 Soldering
       2.1 Solderability
       2.2 Resistance to soldering heat
       2.3 Resistance of plastic encapsulated SMDs to the
            combined effect of moisture and soldering heat
    3 Vibration (sinusoidal)
    4 Shock
    5 Acceleration, steady state
    6 Bond strength test
       6.1 General
       6.2 Methods A and B
       6.3 Method C
       6.4 Method D
       6.5 Methods E and F
       6.6 Method G
       6.7 Information to be given in the relevant specification
    7 Die shear strength test
       7.1 Object
       7.2 Description of the test apparatus
       7.3 Test method
       7.4 Failure criteria
       7.5 Requirements
       7.6 Information to be given in the relevant specification
    Chapter 3: Climatic Test Methods
    1 Change of temperature
       1.1 Rapid change of temperature: two-chamber method
       1.2 Rapid change of temperature: two-fluid-bath method
    2 Storage (at high temperature)
    3 Low air pressure
    4A Damp heat, steady state
    4B Damp heat. steady state, accelerated
    4C Damp heat, steady state, highly accelerated
    5 Sealing
       5.1 General terms
       5.2 Bomb pressure test
       5.3 Fine leak detection: radioactive krypton method
       5.4 Fine leak detection: tracer gas (helium) method
            with mass spectrometer
       5.5 Gross leaks, perfluorocarbon vapour method using
            electronic detection apparatus
       5.6 Gross leak - Perfluorocarbon - bubble detection
            method
       5.7 Test condition E, weight-gain gross-leak detection
       5.8 Penetrant dye gross leak detection
       5.9 Gross leak re-test
    6 Salt mist
    7 Thermal intermittence test
    8 Internal moisture content measurement by mass spectrometry
       method
       8.1 Object
       8.2 General description
       8.3 Test apparatus
       8.4 Preconditioning
       8.5 Conditioning
       8.6 Requirements
       8.7 Information to be given in the relevant specification
       8.8 Guidance
    Chapter 4: Miscellaneous Test Methods
    1 Flammability tests of plastic-encapsulated devices
       1.1 Flammability (internally induced)
       1.2 Flammability (externally induced)
    2 Permanence of marking
    Annex A (normative) Guidance
    Figures
    Tables

    Abstract - (Show below) - (Hide below)

    Lists test methods applicable to semiconductor devices (discrete devices and integrated circuits) from which a selection may be made.Establishes uniform preferred test methods with preferred values for stress levels for judging the environmental properties of semiconductor devices.

    Standards Referenced By This Book - (Show below) - (Hide below)

    11/30234042 DC : 0 BS EN 62595-1-1 ED.1 - LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION
    BS CECC 265001:1998 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - TECHNOLOGY APPROVAL SCHEDULE - FILM AND HYBRID INTEGRATED CIRCUITS
    BS QC 720102:1997 BLANK DETAIL SPECIFICATION FOR LASER DIODE MODULES WITH PIGTAIL FOR FIBRE OPTIC SYSTEMS AND SUBSYSTEMS
    BS IEC 62679-1-1:2014 (published 2014-07) Electronic paper displays Terminology
    04/30112662 DC : DRAFT APR 2004 IEC 61810-7 ED.2 - ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES
    BS IEC 60748-2.11 : 1999 SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - DIGITAL INTEGRATED CIRCUITS - BLANK DETAIL SPECIFICATION FOR SINGLE SUPPLY INTEGRATED CIRCUIT, ELECTRICALLY ERASABLE, AND PROGRAMMABLE READ-ONLY MEMORY
    03/117620 DC : DRAFT NOV 2003 IEC 60747-1 ED.2 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 1: GENERAL
    BS QC 750111:1991 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DISCRETE DEVICES - BLANK DETAIL SPECIFICATION - BIDIRECTIONAL TRIODE THYRISTORS (TRIACS), AMBIENT OR CASE-RATED, UP TO 100 A
    BS 6493-2.1:1985 Semiconductor devices. Integrated circuits General
    BS QC750116(2000) : 2000 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - MICROWAVE DIODES AND TRANSISTORS - INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS - BLANK DETAIL SPECIFICATION
    BS EN 165000-1:1996 FILM AND HYBRID INTEGRATED CIRCUITS - GENERIC SPECIFICATION - PART 1: CAPABILITY APPROVAL PROCEDURE
    BS QC750100(1986) : 1986 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - DISCRETE SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION
    IEC 60300-3-7:1999 Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware
    IEC 61747-5:1998 Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods
    EN 61747-5:1998 Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods
    EN 190102:1994 Family Specification: TTL-Schottky digital integrated circuits - Series 54S, 64S, 74S, 84S
    EN 61643-321:2002 Components for low-voltage surge protective devices - Part 321: Specifications for Avalanche Breakdown Diode (ABD)
    BS CECC 90202:1990 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: INTEGRATED OPERATIONAL AMPLIFIERS
    BS EN 61751:1998 LASER MODULES USED FOR TELECOMMUNICATION - RELIABILITY ASSESSMENT
    BS EN 61747-5:1998 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS
    11/30241341 DC : DRAFT JAN 2011 BS EN 62149-7 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 7: 1310 NM DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER DEVICES
    BS EN 190101:1994 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - FAMILY SPECIFICATION: DIGITAL INTEGRATED TTL CIRCUITS SERIES 54, 64, 74, 84
    12/30244653 DC : 0 BS EN 62679-1 - ELECTRONIC PAPER DISPLAY - PART 1:TERMINOLOGY AND GENERIC SPECIFICATION
    BS IEC 60747-4.2 : 2000 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - MICROWAVE DIODES AND TRANSISTORS - INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS - BLANK DETAIL SPECIFICATION
    CEI EN 61643-341 : 2002 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 341: SPECIFICATION FOR THYRISTOR SURGE SUPPRESSOR (TSS)
    BS QC 763000(1990) : AMD 6754 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID FILM INTEGRATED CIRCUITS. GENERIC SPECIFICATION
    BS IEC 60300-3.7 : 1999 DEPENDABILITY MANAGEMENT - APPLICATION GUIDE - RELIABILITY STRESS SCREENING OF ELECTRONIC HARDWARE
    BS IEC 60748-11:2000 Semiconductor devices. Integrated circuits Sectional specification for semiconductor integrated circuits excluding hybrid circuits
    CEI EN 61643-321 : 2003 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 321: SPECIFICATIONS FOR AVALANCHE BREAKDOWN DIODE (ABD)
    CEI EN 61747-1 : 2004 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION
    IEC TS 61945:2000 Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis
    IEC 61747-1-1:2014 Liquid crystal display devices - Part 1-1: Generic - Generic specification
    IEC 60748-2-12:2001 Semiconductor devices - Integrated circuits - part2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)
    IEC 60747-4-2:2000 Semiconductor devices - Discrete devices - Part 4-2: Microwave diodes and transistors - Integrated-circuit microwave amplifiers - Blank detail specification
    OVE/ONORM EN 61760-1 : 2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    BS CECC 90201:1990 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: INTEGRATED VOLTAGE REGULATORS
    I.S. EN 61751:1999 LASER MODULES USED FOR TELECOMMUNICATION - RELIABILITY ASSESSMENT
    07/30162213 DC : 0 BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES
    08/30181401 DC : DRAFT APR 2008 BS IEC 60747-14-1 - SEMICONDUCTOR DEVICES - PART 14-1: SEMICONDUCTOR SENSORS - GENERIC SPECIFICATION FOR SENSORS
    BS QC 790109:1992 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - FAMILY SPECIFICATION FOR HCMOS DIGITAL INTEGRATED CIRCUITS SERIES 54/74 HC, 54/74 HCT, 54/74 HCU
    BS EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
    11/30252972 DC : 0 BS EN 61747-10-1 - LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL
    02/205627 DC : DRAFT APR 2002 IEC 60747-14-4. ED.1.0 - DISCRETE SEMICONDUCTOR DEVICES - PART 14-4: SEMICONDUCTOR ACCELEROMETERS
    BS IEC 60748-23-1:2002 Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Generic specification
    05/30137514 DC : DRAFT AUG 2005 IEC 60747-14-4 - DISCRETE SEMICONDUCTOR DEVICES - PART 14-4: SEMICONDUCTOR ACCELEROMETERS
    BS IEC 60748-2.12 : 2001 SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - DIGITAL INTEGRATED CIRCUITS - BLANK DETAIL SPECIFICATION FOR PROGRAMMABLE LOGIC DEVICES (PLDS)
    BS QC790100(1991) : 1991 AMD 10586 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION FOR SEMICONDUCTOR INTEGRATED CIRCUITS EXCLUDING HYBRID CIRCUITS
    IEC 60748-23-1:2002 Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
    IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
    IEC 62679-1-1:2014 Electronic paper displays - Part 1-1: Terminology
    IEC 60747-10:1991 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
    I.S. EN 61747-5:1999 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS
    EN 61643-341:2001 Components for low-voltage surge protective devices - Part 341: Specification for thyristor surge suppressors (TSS)
    09/30192488 DC : 0 BS EN 62595 ED.1 - MEASUREMENT METHODS OF LED BACKLIGHT UNIT FOR LIQUID CRYSTAL DISPLAYS
    12/30268616 DC : 0 BS EN 61747-1-1 - LIQUID CRYSTAL DISPLAY DEVICES - PART 1-1: GENERIC - GENERIC SPECIFICATION
    BS EN 61643-321:2002 Low voltage surge protective devices Specifications for avalanche breakdown diode (ABD)
    11/30252977 DC : 0 BS EN 61747-10-2 - LIQUID CRYSTAL DISPLAY DEVICES - PART 10-2: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - ENVIRONMENTAL AND ENDURANCE
    BS EN 61643-341:2001 LOW VOLTAGE SURGE PROTECTIVE DEVICES - SPECIFICATION FOR THYRISTOR SURGE SUPPRESSORS (TSS)
    BS QC 720104:1997 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - OPTOELECTRONIC DEVICES - BLANK DETAIL SPECIFICATION FOR PIN-FET MODULES WITH/WITHOUT PIGTAIL, FOR FIBRE OPTIC SYSTEMS OR SUBSYSTEMS
    BS EN 190103:1994 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - FAMILY SPECIFICATION: DIGITAL INTEGRATED TTL LOW POWER SCHOTTKY, CIRCUITS, SERIES 54LS, 64LS, 74LS, 84LS
    BS EN 190102:1994 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - FAMILY SPECIFICATION: DIGITAL INTEGRATED TTL-SCHOTTKY CIRCUITS, SERIES 54S, 64S, 74S, 84S
    17/30340372 DC : 0 BS EN 62906-5-1 ED 1.0 - LASER DISPLAY DEVICES - PART 5-1: MEASUREMENT OF OPTICAL PERFORMANCE FOR LASER FRONT PROJECTION
    11/30252924 DC : 0 BS EN 60747-5-6 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 5-6: OPTOELECTRONIC DEVICES - LIGHT EMITTING DIODES
    BS QC 790202:1991 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - BLANK DETAIL SPECIFICATION - MONOLITHIC INTEGRATED OPERATIONAL AMPLIFIERS
    BS EN 61747-1:2000 LIQUID CRYSTAL AND SOLID STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION
    I.S. EN 165000-1:1998 FILM AND HYBRID INTEGRATED CIRCUITS - PART 1: GENERIC SPECIFICATION CAPABILITY APPROVAL PROCEDURE
    I.S. EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES
    IEC 60748-11:1990 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
    IEC 61643-321:2001 Components for low-voltage surge protective devices - Part 321: Specifications for avalanche breakdown diode (ABD)
    IEC 61751:1998 Laser modules used for telecommunication - Reliability assessment
    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
    IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    EN 61751:1998 Laser modules used for telecommunication - Reliability assessment
    09/30183239 DC : 0 BS EN 62572-3 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION
    DIN EN 190000:1996-05 GENERIC SPECIFICATION - MONOLITHIC INTEGRATED CIRCUITS
    BS QC 750000(1986) : 1986 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - DISCRETE SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION
    BS IEC 60747-5-4:2006 Semiconductor devices. Discrete devices Optoelectronic devices. Semiconductor lasers
    IEC 60747-4-1:2000 Semiconductor devices - Discrete devices - Part 4-1: Microwave diodes and transistors - Microwave field effect transistors - Blank detail specification
    07/30148822 DC : 0 BS IEC 62047-4 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATIONS FOR MEMS
    BIS IS 15934-5 : 2011 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS
    CEI 56-44 : 2000 DEPENDABILITY MANAGEMENT - PART 3-7: APPLICATION GUIDE - RELIABILITY STRESS SCREENING OF ELECTRONIC HARDWARE
    IEC 61643-341:2001 Components for low-voltage surge protective devices - Part 341: Specification for thyristor surge suppressors (TSS)
    EN 61747-1:1999/A1:2003 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION
    EN 165000-1:1996 Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure
    EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60653:1979 General considerations on ultrasonic cleaning
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 60068-2-13:1983 Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure
    IEC 60068-2-11:1981 Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist
    IEC 60068-2-47:2005 Environmental testing - Part 2-47: Test - Mounting of specimens for vibration, impact and similar dynamic tests
    IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
    IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
    IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
    IEC 60748-1:2002 Semiconductor devices - Integrated circuits - Part 1: General
    IEC 60068-2-48:1982 Environmental testing - Part 2: Tests. Guidance on the application of the tests of IEC 68 to simulate the effects of storage
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
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