IEC PAS 62647-2:2011
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
29-11-2012
English
22-06-2011
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
INTRODUCTION
1 Scope
2 Terms and definitions
3 Requirements
Annex A (informative) - Guidance on control levels, risk
assessment, and mitigation evaluation
Annex B (informative) - Technical guide on tin whiskers
Annex C (informative) - Technical guide on detection
methods, mitigation methods, and
methods for limiting impact of tin
Bibliography
IEC/PAS 62647-2:2011(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of tin finishes in electronic systems. This PAS is applicable to aerospace and high performance electronic applications which procure equipment that may contain Pb-free tin finishes.
| DevelopmentNote |
Stability Date: 2014. (10/2012)
|
| DocumentType |
Miscellaneous Product
|
| Pages |
37
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| NEN NPR IEC/PAS 62647-2 : 2011 | Identical |
| PD IEC/TS 62647-2:2012 | Identical |
| IEC PAS 62647-21:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics |
| PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
| IEC PAS 62647-23:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| IEC PAS 62647-3:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
| PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
| IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| DD IEC PAS 62647-23 : DRAFT AUG 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
| DD IEC PAS 62647-3 : DRAFT SEP 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| NASA STD 8739.1 : 2016 | WORKMANSHIP STANDARD FOR POLYMERIC APPLICATION ON ELECTRONIC ASSEMBLIES |
| IPC JP002 : 0 | JEDEC/IPC CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE |
| IPC CC 830 : B | QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| MIL-I-46058 Revision C:1972 | Insulating Compound, Electrical (for Coating Printed Circuit Assemblies) |
| ASTM B 545 : 2013 : REDLINE | Standard Specification for Electrodeposited Coatings of Tin |
| IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
| GEIA HB 0005-1 : 2006 | PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
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