IPC J STD 609 : A
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MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
IEC PAS 62647-2:2011
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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin |
GEIA HB 0005-2 : 2007
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TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
IPC WP 006 : 2003
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ROUND ROBIN TESTING AND ANALYSIS - LEAD-FREE ALLOYS - TIN, SILVER AND COPPER |
GEIA STD 0005-3 : 2013
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PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES |
IEC PAS 62647-3:2011
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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes |
GEIA HB 649 : 2005
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CONFIGURATION MANAGEMENT STANDARD IMPLEMENTATION GUIDE |
IPC J STD 001 : F
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REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 2225 : 0
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SECTIONAL DESIGN STANDARD FOR ORGANIC MULTICHIP MODULES (MCM-L) AND MCM-L ASSEMBLIES |
IPC J STD 006 : C
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REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
IPC J STD 033C-1:2014
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HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
IEC PAS 62647-22:2011
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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
GEIA HB 0005-3 : 2008
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REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
IPC A 610 : F
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ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
GEIA STD 0005-2 : 2012
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MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
IEC PAS 62647-23:2011
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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
IPC J STD 005 : A
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REQUIREMENTS FOR SOLDERING PASTES |
IPC J STD 002 : D
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SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
GEIA HB 0005-1 : 2006
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PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
IPC 2221B:2012
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GENERIC STANDARD ON PRINTED BOARD DESIGN |
IEC 61191-1:2013
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Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
IEC 61188-5-1:2002
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Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
IPC 1065 : 0
|
MATERIAL DECLARATION HANDBOOK |
GEIA STD 0005-1 : 2012
|
PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
IPC 2222 : A
|
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
IPC 9701 : A
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PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
IPC J STD 028 : 0
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PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS |
IEC PAS 62647-21:2011
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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics |
IEC 60068-2-1:2007
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Environmental testing - Part 2-1: Tests - Test A: Cold |
IPC J STD 003 : C
|
SOLDERABILITY TESTS FOR PRINTED BOARDS |
IPC 6013 : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
IPC 6015 : 0
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES |
GEIA EIA649B:2011
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CONFIGURATION MANAGEMENT STANDARD |
ASME Y14.100 : 2017
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ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
IPC 2223 : C
|
SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
IEC TS 62647-2:2012
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
IPC 6012 : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |