IEC TR 61189-3-914:2017
Current
The latest, up-to-date edition.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English
17-03-2017
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Test condition
5 Pre-condition
6 Heat dissipation characteristics
Annex A (informative) - Classification and class of
the PCB
Annex B (informative) - Measurement comparison
between companies (plane)
IEC TR 61189-3-914:2017(E) specifies the detailed procedures and precautions for IEC 61189-3-913.
| DevelopmentNote |
Stability Date: 2022. (03/2017)
|
| DocumentType |
Technical Report
|
| Pages |
24
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| PD IEC/TR 61189-3-914:2017 | Identical |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 61189-3-913:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
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