IEC TR 61191-7:2020
Current
The latest, up-to-date edition.
Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English
11-03-2020
IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.
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