Printed board assemblies Technical cleanliness of components and printed board assemblies

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Hardcopy , PDF

Language(s)

English

Published date

23-03-2020

Publisher

British Standards Institution

This part of IEC 61191 serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry.

This part of IEC 61191 serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.

Committee	EPL/501
DocumentType	Standard
ISBN	9780539051186
Pages	118
PublisherName	British Standards Institution
Status	Current

Standards	Relationship
IEC TR 61191-7:2020	Identical

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PD IEC TR 61191-7:2020

Printed board assemblies Technical cleanliness of components and printed board assemblies

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