IEC TR 62258-3:2005
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
31-12-2021
English
13-06-2005
Important note : Users cannot be edited or removed once added to your Multi user PDF.This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including:- singulated bare die,- minimally or partially encapsulated die and wafers.This report contains suggested good practice for the handling, packing and storage of die products.Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly.
| DocumentType |
Technical Report
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| Pages |
44
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
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