• IEC TR 62258-3:2010

    Current The latest, up-to-date edition.

    Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English, English - French, Russian

    Published date:  06-08-2010

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Handling - Good practice
    5 Process handling issues
    6 Die and wafer transport and storage media
    7 Storage good practice
    8 Traceability good practice
    9 Guidelines for long-term storage (die banking) of
       bare die and wafers
    10 Good practice for automated handling during
       assembly
    Annex A (informative) - Planning checklist
    Annex B (informative) - Material specifications
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC/TR 62258-3:2010 has been developed to facilitate the production, supply and use of semiconductor die products, including:
    - wafers,
    - singulated bare die,
    - die and wafers with attached connection structures,
    - and minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products. Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly. This edition includes the following significant technical changes with respect to the previous edition.
    1. Special requirements have been added throughout the document for optical die, where applicable. For example see 4.3 paragraph 4 and 10.1.3 paragraph 3.
    2. The following new subclauses have been added:
    - 4.4.6 ESD Guidelines
    - 5.1 Wafer thinning
    3. Subclause 5.2 (Singulation or die separation) has been renamed from the previous Subclause 5.1 (Wafer sawing) and has been expanded to included other methods of singulation or sawing, including:
    - 5.2.2 Wafer scribing
    - 5.2.3 Laser cutting
    - 5.2.4 Dice before grind (DBG)
    4. Subclause 5.3.7 (previous edition Subclause 5.2.7) has been changed to include optical and microwave die.
    5. In Subclause 6.3, the Subclause 6.3.2 (Specialised wafer tubs) has been added to include wafer taubs specially handle and ship wafers that have not been singulated.
    6. Two new Subclauses have been to Clause 6:
    - 6.9 Handling and packing of thinned die or wafers
    - 6.10 Packing materials and their reuse
    7. A new subclause has been added to Subclause 9.6:
    - 9.6.3 Use of packing material having sacrificial properties
    8. Annex A (Planning checklist) has been updated throughout.
    9. In Annex B (Material specifications) a new Subclause has been added:
    - B.5 Adhesive gel tray material specifications.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47
    Development Note Stability Date: 2020. (09/2017)
    Document Type Technical Report
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 62258-1 : 2010 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
    I.S. EN 62258-1:2010 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
    EN 62435-5 : 2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES (IEC 62435-5:2017)
    CLC/TS 50466:2006 Long duration storage of electronic components - Specification for implementation
    EN 62435-1 : 2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL (IEC 62435-1:2017)
    EN 62258-1:2010 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
    I.S. EN 62435-1:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
    I.S. CLC TS 50466:2006 LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION
    I.S. EN 62435-5:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
    CEI CLC/TS 50466 : 2006 LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION
    I.S. EN 62435-2:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
    IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
    09/30214337 DC : 0 BS EN 60286-3 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES
    I.S. EN 60286-3:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013 (EQV))
    BS EN 62435-2:2017 Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms
    DD CLC/TS 50466:2006 (published 2008-06) Long duration storage of electronic components. Specification for implementation
    BS EN 60286-3:2013 (published 2013-11) Packaging of components for automatic handling Packaging of surface mount components on continuous tapes
    IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
    IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
    IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
    BS EN 62435-5 : 2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
    BS EN 62435-1 : 2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL (IEC 62435-1:2017)
    05/30139061 DC : DRAFT SEP 2005 IEC 60286-3 - PACKING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES
    IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
    CEI EN 62258-1 : 2011 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
    EN 60286-3:2013/AC:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
    EN 62435-2 : 2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS (IEC 62435-2:2017)

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
    IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
    IEC TR 61340-5-2:2007 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
    IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
    ISO 14644-1:2015 Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration
    IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
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