IECQ 03-3:2013
Current
The latest, up-to-date edition.
IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 3: IECQ APPROVED COMPONENT PRODUCTS, RELATED MATERIALS & ASSEMBLIES SCHEME
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English
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and Definitions
4 Governing of the IECQ Scheme
5 Principles of the IECQ Approved Component Scheme
6 Organizational structure
7 IECQ Approved Component Certification,
Documentation Requirements
8 IECQ Approved Component Certification procedure
9 Acceptance of IECQ Certification Bodies (IECQ CB)
Annex A (normative) - Flow-chart for the application
of Approved Component (IECQ AC)
Annex B (normative) - Attestation of conformity
Annex C (normative) - IECQ Qualification Approval (QA)
Annex D (normative) - IECQ Approved Component -
Capability Certification (IECQ AC-C)
Annex E (normative) - Requirements for specifications
used for Approved Components
Provides the Rules of Procedure of the Scheme of the IECQ, hereinafter referred to as the "Rules", for the Approved Component Products, Related Materials & Assemblies Scheme.
| DevelopmentNote |
Russian version issued on 21/06/2013. (06/2013)
|
| DocumentType |
Standard
|
| Pages |
50
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| 14/30311384 DC : 0 | BS EN 60115-2:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| EN 60115-2:2015 | Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors |
| BS EN 60115-8-1:2015 | Fixed resistors for use in electronic equipment Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| I.S. EN 60115-8-1:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| IECQ 03-3-1:2013 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 3-1: IECQ APPROVED COMPONENT PRODUCTS, RELATED MATERIALS & ASSEMBLIES SCHEME, IECQ APPROVED COMPONENT-TECHNOLOGY CERTIFICATION (IECQ AC-TC) |
| 13/30287806 DC : 0 | BS EN 60539-1 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
| BS EN 60115-2:2015 | Fixed resistors for use in electronic equipment Sectional specification: Leaded fixed low power film resistors |
| CEI EN 60115-8-1 : 2016 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| I.S. EN 60115-2:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| 14/30317306 DC : 0 | BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| IEC 60115-8-1:2014 | Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| IEC 60115-2:2014 | Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors |
| CEI EN 60115-2 : 2016 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| IECQ 03-3-2:2014 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PRODECURE - PART 3-2: IECQ APPROVED COMPONENT PRODUCTS, RELATED MATERIALS & ASSEMBLIES SCHEME, IECQ APPROVED COMPONENT - AUTOMOTIVE QUALIFICATION PROGRAMME (IECQ AC-AQP) |
| IEC 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
| IECQ CS 033200-TW0001:2014 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - TOUCH PANELS: RESISTIVE TOUCH PANEL |
| EN 60115-8-1:2015 | Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| CEI EN 60115-1:2023 | Fixed resistors for use in electronic equipment Part 1: Generic specification |
| IECQ 03-1:2012 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 1: GENERAL REQUIREMENTS FOR ALL IECQ SCHEMES |
| ISO/IEC 17025:2005 | General requirements for the competence of testing and calibration laboratories |
| ISO/IEC 17000:2004 | Conformity assessment Vocabulary and general principles |
| ISO/IEC 17050-1:2004 | Conformity assessment Supplier's declaration of conformity Part 1: General requirements |
| ISO/IEC 17021:2011 | Conformity assessment Requirements for bodies providing audit and certification of management systems |
| IECQ 01:2014 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - BASIC RULES |
| ISO 9001:2015 | Quality management systems — Requirements |
| ISO/IEC Guide 65:1996 | General requirements for bodies operating product certification systems |
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