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IEEE 2401-2015

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

IEEE Standard Format for LSI-Package-Board Interoperable Design

Superseded date

27-01-2020

Published date

18-12-2015

1. Overview
2. Normative references
3. Definitions, acronyms, and abbreviations
4. Concept of the LPB Format
5. Language basics
6. Common elements in M-Format, C-Format,
    and R-Format
7. M-Format
8. C-Format
9. R-Format
10. N-Format
11. G-Format
Annex A (informative) - Bibliography
Annex B (informative) - Examples of utilization
Annex C (informative) - XML Encryption
Annex D (informative) - MD5 checksum
Annex E (informative) - Chip-Package Interface
        Protocol
Annex F (informative) - IEEE list of parti cipants

Specifies a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSI are interconnected.

Committee
Design Automation
DevelopmentNote
Also numbered as IEC 63055. (11/2016)
DocumentType
Standard
PublisherName
Institute of Electrical & Electronics Engineers
Status
Superseded
SupersededBy

IEEE 1364-2005 IEEE Standard for Verilog Hardware Description Language
IEC 62433-2:2017 EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
IEC 62433-4:2016 EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)
IEEE 1076-2008 REDLINE IEEE Standard VHDL Language Reference Manual
IEC 62433-3:2017 EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)

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