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  • IEEE 2401-2015

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    IEEE Standard Format for LSI-Package-Board Interoperable Design

    Available format(s): 

    Superseded date:  27-01-2020

    Language(s): 

    Published date:  18-12-2015

    Publisher:  Institute of Electrical & Electronics Engineers

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    Table of Contents - (Show below) - (Hide below)

    1. Overview
    2. Normative references
    3. Definitions, acronyms, and abbreviations
    4. Concept of the LPB Format
    5. Language basics
    6. Common elements in M-Format, C-Format,
        and R-Format
    7. M-Format
    8. C-Format
    9. R-Format
    10. N-Format
    11. G-Format
    Annex A (informative) - Bibliography
    Annex B (informative) - Examples of utilization
    Annex C (informative) - XML Encryption
    Annex D (informative) - MD5 checksum
    Annex E (informative) - Chip-Package Interface
            Protocol
    Annex F (informative) - IEEE list of parti cipants

    Abstract - (Show below) - (Hide below)

    Specifies a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSI are interconnected.

    General Product Information - (Show below) - (Hide below)

    Committee Design Automation
    Development Note Also numbered as IEC 63055. (11/2016)
    Document Type Standard
    Publisher Institute of Electrical & Electronics Engineers
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    IEEE 1364-2005 IEEE Standard for Verilog Hardware Description Language
    IEC 62433-2:2017 EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
    IEC 62433-4:2016 EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)
    IEEE 1076-2008 REDLINE IEEE Standard VHDL Language Reference Manual
    IEC 62433-3:2017 EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)
    View more information

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