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IPC-7095D:2018

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

Published date

22-02-2019

Superseded date

25-01-2025

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This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages

DocumentType
Standard
ProductNote
New Child AMD1 is Added
PublisherName
IPC by Global Electronics Association
Status
Superseded
SupersededBy
Supersedes

Sorry this product is not available in your region.