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IPC 7095 : C

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS

Available format(s)

Hardcopy

Superseded date

22-02-2019

Language(s)

English

1 SCOPE
2 APPLICABLE DOCUMENTS
3 SELECTION CRITERIA AND MANAGING BGA IMPLEMENTATION
4 COMPONENT CONSIDERATIONS
5 PRINTED BOARDS AND OTHER MOUNTING STRUCTURES
6 PRINTED CIRCUIT ASSEMBLY DESIGN CONSIDERATION
7 ASSEMBLY OF BGAS ON PRINTED CIRCUIT BOARDS
8 RELIABILITY
9 DEFECT AND FAILURE ANALYSIS CASE STUDIES
10 GLOSSARY AND ACRONYMS
11 BIBLIOGRAPHY AND REFERENCES
Appendix A - Process Control Characterization to Reduce
             the Occurrence of Voids

Specifies the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology.

DevelopmentNote
Included in IPC C 103 & IPC C 1000. (12/2013) Supersedes J STD 013. (01/2015) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
Pages
176
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

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