![header thumbnail](/images/publishers\ipc_cover.gif)
IPC-7095D-WAM1:2018/AMD 1:2019
Current
The latest, up-to-date edition.
![header thumbnail](/images/publishers\ipc_cover.gif)
Design and Assembly Process Implementation for BGAs, with Amendment 1
Hardcopy
English - Chinese, Japanese
01-06-2019
The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages.
DocumentType |
Amendment
|
ISBN |
978-1-951577-22-3
|
Pages |
0
|
PublisherName |
Institute of Printed Circuits
|
Status |
Current
|
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