IPC A 20/21 : 1996
Current
Current
The latest, up-to-date edition.
STANDARD PITCH STENCIL PATTERN FOR SLUMP - GERBER FORMAT
Available format(s)
Hardcopy
Language(s)
English
Published date
01-02-1996
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.These Gerber electronic files include patterns for development of solder paste stencils by laser or chemical etching. Gives land widths of 0.4 mm, 0.63 mm and 1.25 mm so as to evaluate solder paste slump. J STD 005 is included with each order.
| DevelopmentNote |
Available in Gerber format. (12/2001) Available as a KIT with J STD 005. (07/2008)
|
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
| IPC J STD 005 RUSSIAN : A | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| IPC J STD 005 CHINESE : A | REQUIREMENTS FOR SOLDERING PASTES |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
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