IPC J STD 005 : A
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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REQUIREMENTS FOR SOLDERING PASTES
Available format(s)
PDF
Language(s)
English
Publisher
Superseded date
07-05-2024
Superseded by
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Summarise this standard
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1 GENERAL
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PREPARATION FOR DELIVERY
6 NOTES
APPENDIX A - Test Report on Solder Paste
Specifies requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes.
| DevelopmentNote |
Supersedes QQ S 571, IPC SP 819, QPL 14256 and QPL QQ S 571. Included in IPC C 103 & IPC C 1000. (07/2009) 1995 Edition is still available in Japanese Language, See J STD 005 JAPANESE. (02/2012) Also available in Russian Language, See J STD 005 RUSSIAN. (11/2012) Also available in Chinese Language, See J STD 005 CHINESE. (03/2013) Also available in Hardcopy format. (01/2018)
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| DocumentType |
Standard
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| Pages |
10
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Superseded
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| Supersedes |