IPC J STD 005 : A
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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REQUIREMENTS FOR SOLDERING PASTES
Publisher
Superseded date
07-05-2024
Superseded by
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1 GENERAL
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PREPARATION FOR DELIVERY
6 NOTES
APPENDIX A - Test Report on Solder Paste
Specifies requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes.
| DevelopmentNote |
Supersedes QQ S 571, IPC SP 819, QPL 14256 and QPL QQ S 571. Included in IPC C 103 & IPC C 1000. (07/2009) 1995 Edition is still available in Japanese Language, See J STD 005 JAPANESE. (02/2012) Also available in Russian Language, See J STD 005 RUSSIAN. (11/2012) Also available in Chinese Language, See J STD 005 CHINESE. (03/2013) Also available in Hardcopy format. (01/2018)
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| DocumentType |
Standard
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
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| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
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| PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
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