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IPC AC 62 : A

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

AQUEOUS POST SOLDER CLEANING HANDBOOK

Available format(s)

Hardcopy

Superseded date

01-07-2011

Superseded by

IPC CH 65 : B

Language(s)

English

€65.33
Excluding VAT

1.0 SCOPE
1.1 Purpose
2.0 APPLICABLE IPC DOCUMENTS AND REFERENCES
2.1 Joint Industry Standards
3.0 TERMS AND DEFINITIONS
3.1 "Aqueous Cleaning"
3.2 "Wash" or "Washing"
3.3 "Rinse" or "Rinsing"
3.4 "Drying"
3.5 "Gross Drying"
3.6 "Defluxing" ("Flux Removal" or "Post
      Solder Cleaning")
3.7 "Fine Cleaning"
3.8 "Screen and Stencil Cleaning"
3.9 "Semi-Aqueous Cleaning"
3.10 "Organic Solvent Cleaning"
3.11 "Non-Reactive Additives"
3.12 "Reactive Additives or Reactants"
3.13 "Organic Solvent Emulsions in Aqueous Media"
3.14 "Manual Cleaning"
3.15 "Batch Cleaning"
3.16 "In-Line Cleaning"
4.0 INTRODUCTION
5.0 OBJECTIVES OF THE CLEANING PROCESS DESIGN
6.0 CONTAMINANT TYPES AND REMOVAL CHARACTERISTICS
6.1 Polar Residues
6.2 Non-Polar Water Soluble Residues
6.3 Non-Polar Water Insoluble Residues
6.4 Non-Solubilizable Residues
7.0 MECHANISMS AND EFFECTS OF AQUEOUS CLEANING
7.1 Wetting of surfaces
7.2 Dissolution
     7.2.1 Ionic Dissolution
     7.2.2 Non-Ionic Dissolution
     7.2.3 Surface Agent Dissolution, Emulsification
     7.2.4 Saponifier Dissolution
     7.2.5 Chelation Dissolution
7.3 Solder Ball and Particulate Removal
7.4 The Physics of Cleaning
     7.4.1 Temperature
     7.4.2 Mechanical Agitation
     7.4.3 Ultrasonic Agitation
7.5 Rinsing
7.6 Drying
8.0 FACTORS THAT INFLUENCE SELECTION OF WASH AND RINSE
     MEDIA, PROCESS CONDITIONS AND APPLICATION EQUIPMENT
8.1 Environmental, Safety and Health Aspects
     8.1.1 Waste Type and Quantity Generated, Waste
           Management
     8.1.2 Conservation Efforts and Feasibility
     8.1.3 Hazards and Controls
8.2 Type of Flux and Contaminants to be Removed
8.3 Degree of Cleanliness to be Achieved and Volume
     to be Processed
8.4 Materials and Component Compatibility with Media
     and Process
8.5 Equipment Compatibility with Media
8.6 Part Geometry
8.7 Process Cost
     8.7.1 Cost Model Elements
9.0 WATER RESOURCES AND QUALITY
9.1 Measurement of Water Purity
     9.1.1 Non-Ionic
     9.1.2 Ionic
9.2 Water Purity Standards
9.3 Water Purification Methods
     9.3.1 Mechanical Filtration
     9.3.2 Water Softening
     9.3.3 Dissolved Mineral Removal
     9.3.4 Miscellaneous Methods
10.0 WASH AND RINSE MEDIA
10.1 Water without Additives
10.2 Surfactants and Other Non Reactive Type Additives
10.3 Non Saponifier Reactive Additives
10.4 Saponifiers
10.5 Organic Solvent Emulsions in Water
10.6 Rinse Water Parameters
11.0 THE WASH/RINSE/DRY PROCESS
11.1 Application Methods, Wash and Rinse
     11.1.1 Brush
     11.1.2 Immersion
     11.1.3 Spray in Air
     11.1.4 Spray Under Immersion
     11.1.5 Centrifugal
     11.1.6 Ultrasonics
11.2 Drying
     11.2.1 Gross and Fine Drying
     11.2.2 Air-knife and Forced Air Drying
     11.2.3 Radiation Drying
     11.2.4 Vacuum Drying
     11.2.5 Organic Solvent Drying Agents
     11.2.6 Centrifugal
11.3 Solder Flux Removal
     11.3.1 Water Soluble Organic Acid Flux
     11.3.2 Rosin Type Flux
     11.3.3 SA Type Flux
     11.3.4 Low Residue/No-Clean Flux
     11.3.5 Removal of Other Materials
     11.3.6 Solder Paste Removal from Stencils
11.4 Fine Cleaning
12.0 EFFECTS FROM AQUEOUS MEDIA, APPLICATION AND DRYING
     METHOD ON MATERIALS AND ELECTRICAL COMPONENTS
12.1 Chemical Effects
     12.1.1 Water without Additives
     12.1.2 Water with Additives
12.2 Thermal Effects
12.3 Mechanical Effects from Spray Impact
12.4 Effects from Ultrasonic Energy
12.5 Effects from Centrifugal Forces
12.6 Electrostatic Discharge from Drying Operations
13.0 APPLICATION EQUIPMENT
13.1 Bench Top, Manual
     13.1.1 Open Tank Cleaning
     13.1.2 Non-Immersion Cleaning
     13.1.3 Drying
13.2 Batch Type
     13.2.1 Single-Chamber Spray
     13.2.2 Multi-Chamber Immersion
     13.2.3 Multi-Chamber Spray
13.3 In-Line Equipment
13.4 Screen and Stencil Cleaners
14.0 EVALUATION AND PROCESS OPTIMIZATION
14.1 Evaluation and Data Collection
     14.1.1 Material and Component Compatibility
     14.1.2 Testing for Residues (Surface Cleanliness)
     14.1.3 Electrical/Environmental Testing
14.2 Optimizing and Controlling Process Parameters
     14.2.1 Process Controls
15.0 WASTE MANAGEMENT AND REGULATORY ISSUES
15.1 Environmental Issues
     15.1.1 Air Emissions
     15.1.2 Wastewater
     15.1.3 Solid Waste
15.2 Contamination Removal and Treatment
     15.2.1 Air Emissions
     15.2.2 Wastewater
     15.2.3 Solid Waste
Appendix A
Appendix B

Describes manufacturing residues, types and properties of aqueous cleaning agents, aqueous cleaning processes and equipment, process and quality control, environmental controls and considerations, worker safety, cleanliness determination, measurement and cost.

DevelopmentNote
Also available in CD-ROM format. (09/2005) Included in IPC C 108 & IPC C 1000. (06/2008)
DocumentType
Standard
Pages
49
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC 7526 : 2007 STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK
IPC HDBK 840 : 0 SOLDER MASK HANDBOOK
IPC SA 61 : A POST SOLDER SEMI-AQUEOUS CLEANING HANDBOOK
IPC TR 582 : 0 CLEANING AND CLEANLINESS TESTING PROGRAM FOR PHASE 3 - LOW SOLIDS, FLUXES AND PASTES PROCESSED IN AMBIENT AIR
IPC M 108 : LATEST CLEANING GUIDES AND HANDBOOKS MANUAL
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC TR 580 : 1989 CLEANING AND CLEANLINESS TEST PROGRAM, PHASE 1 TEST RESULTS
IPC TR 581 : 1994 IPC PHASE 3 CONTROLLED ATMOSPHERE SOLDERING STUDY

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