IPC CM 78 : LATEST
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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GUIDELINES FOR SURFACE MOUNTING AND INTERCONNECTING CHIP CARRIERS
05-06-1991
12-01-2013
Provides guidelines for the mounting of JEDEC standard chip carriers with terminal on 0.040 inch and 0.050 inch centers. Sockets used in the mounting of these chip carriers are also covered. Provides information of processing and on various types of substrate and joining materials used in assembly of chip carriers in order to aid the user and manufacturer. The substrate physical and electrical characteristics and their compatibility for chip carriers are discussed. Land designs, solder joint configurations, rework, repair, etc., are also discussed. Adherence to the guidelines set forth in this document will generally assure adequate reliability for the majority of applications; however, more rigid requirements may be appropriate for more critical applications.
| DocumentType |
Standard
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| PublisherName |
Institute of Printed Circuits
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| Status |
Superseded
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| SupersededBy |
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