IPC SM 780 : 0

1.0 INTRODUCTION
     1.1 Scope
     1.2 Purpose
     1.3 Classification
     1.4 Terms and Definitions
2.0 REFERENCE DOCUMENTS
     2.1 Institute for Interconnecting and Packaging
          Electronic Circuits (IPC)
     2.2 Electronic Industries Association (EIA)
     2.3 Military
     2.4 Federal
     2.5 American National Standards Institute (ANSI)
3.0 COMPONENT PACKAGING AND INTERCONNECTION (CPI)
     IMPLEMENTATION CONCEPT
     3.1 System Design Sequence
     3.2 Technology Trends
     3.3 Packaging/Interconnection Assembly
          Implementation Techniques
4.0 ELECTRONIC COMPONENT TYPES AND INTERCONNECTION
     DEVICES
     4.1 General Considerations
     4.2 Discrete Component Types
     4.3 Semiconductor Package Types
     4.4 Sockets and Connectors
5.0 PACKAGING AND INTERCONNECTING STRUCTURE (P&IS) TYPE
     5.1 General Considerations
     5.2 Organic-Base Material P&IS
     5.3 Non-Organic Base Materials
     5.4 Supporting-Plane P&I Structures
     5.5 Constraining Core P&I Structures
6.0 DESIGN PARAMETERS
     6.1 General Considerations
     6.2 System Requirements
     6.3 Packaging Considerations
     6.4 Performance, Reliability and Producibility
     6.5 CAD/CAM Relationships
     6.6 Testing Considerations
     6.7 P&IS Design Issues
7.0 P&I STRUCTURE (P&IS) FABRICATION
     7.1 Organic Printed Boards
     7.2 Constraining Core P&IS
     7.3 Material Considerations
     7.4 Process Flow and Control
     7.5 Fabricating Techniques
     7.6 Quality Conformance Coupons
8.0 ASSEMBLY PROCESSES
     8.1 General Considerations
     8.2 Process Flow
     8.3 Materials
     8.4 Component Preparation
     8.5 Solder Placement
     8.6 Component Placement
     8.7 Surface Mounting
     8.8 Chip-on-Board Placement
     8.9 Component Attachment
     8.10 Cleaning
     8.11 Conformal Coating
9.0 QUALITY ASSURANCE AND TESTING
     9.1 Quality Assurance and Testing
     9.2 Solderability
     9.3 Quality Assurance Provisions
     9.4 Post Assembly Assurance
     9.5 Mechanical and Electrical Testing
     9.6 Solder Joint Mechanism of Failure
     9.7 Handling Electronic Assemblies
10.0 MODIFICATION AND REPAIR
     10.1 Basic Rules
     10.2 Handling Electronic Assemblies
     10.3 General Modification/Repair Procedures
     10.4 P&I Structure Modification/Repair
     10.5 P&I Assembly Modification/Repair Methods
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Tables

Examines key issues in advanced packaging techniques. Gives information on what types of parts are available, the techniques and processes necessary for their proper use, possible advantages/disadvantages or problems, how to start implementation and where to find additional information.