IPC CM 78 : LATEST

Provides guidelines for the mounting of JEDEC standard chip carriers with terminal on 0.040 inch and 0.050 inch centers. Sockets used in the mounting of these chip carriers are also covered. Provides information of processing and on various types of substrate and joining materials used in assembly of chip carriers in order to aid the user and manufacturer. The substrate physical and electrical characteristics and their compatibility for chip carriers are discussed. Land designs, solder joint configurations, rework, repair, etc., are also discussed. Adherence to the guidelines set forth in this document will generally assure adequate reliability for the majority of applications; however, more rigid requirements may be appropriate for more critical applications.