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IPC D 350 : 0

Current

Current

The latest, up-to-date edition.

PRINTED BOARD DESCRIPTION IN DIGITAL FORM

Available format(s)

Hardcopy

Language(s)

English

Published date

01-07-1992

Acknowledgements
Table of Contents
Committee Members
1.0 Scope
1.1 Format Compatibility
2.0 Applicable Documents
2.1 IPC
2.2 American National Standards Institute
2.3 Department of Defense
3. Terms and Definitions
3.1 Annotation
3.2 Comment Records
3.3 Complex or Composite Records
3.4 Data Information Module (DIM)
3.5 Data Layer
3.6 Feature Location Record
3.7 Job Set
3.8 Modal Form
3.9 Parameter Record
3.10 Physical Layer
3.11 Subroutine
3.12 Subroutine Call
4.0 General Requirements
4.1 Data Hierarchy
4.2 Basic Record Types
4.3 Data Set Descriptions
4.4 Data Orientation
4.5 Transfer Media and Data Formats
5.0 Parameter Records
5.1 Parameter JOB
5.2 Parameter - DIM (Data Information Module)
5.3 Parameter - Units
5.4 Parameter - TITLE
5.5 Parameter - NUM
5.6 Parameter - REV
5.7 Parameter - TOL
5.8 Parameter - SCALE
5.9 Parameter Layer
5.10 Parameter - IMAGE
5.11 Parameter - FAB
5.12 Parameter - LANG
6.0 Comment Records
7.0 Feature/Location Area Format
7.1 General Information
7.2 Operations Code Description area
7.3 Features Description Area (FDA)
7.4 Location Description Area (LDA)(Columns 31-72)
7.5 Unassigned Columns
8.0 Line Record Definition
8.1 Special Requirements for Line Records
8.2 Operations Code Definitions (Columns 1-3)
8.3 'D' Field Definition (Columns 4-8)
8.4 Data Layer Code Field (Columns 9-11)
8.5 Signal Identification Field (Columns 12-18)
8.6 'H' Field Definition (Columns 19-23)
8.7 'P' Field Definition (Columns 24-25)
8.8 'G' Field Definition (Columns 26-27)
8.9 LDA Field Definition (Columns 31-72)
9.0 Point Record Definition
9.1 Operation Code Definition (Columns 1-3)
9.2 'D' Field Definition (Columns 4-8)
9.3 Data Layer Code Field (Columns 9-11)
9.4 Signal Identification Field (Columns 12-18)
9.5 'H' Field Definition (Columns 19-23)
9.6 'P' Field Definition (Columns 24 and 25)
9.7 'G' Field Definition (Columns 26-27)
9.8 LDA Field Definition (Columns 31-72)
10.0 Annotation Record Definition
10.1 Annotation Record
10.2 'D' Field Definition (Columns 4-8)
10.3 Data Layer Code Field (Columns 9-11)
10.4 'S' Field Definition (Columns 12-18)
10.5 'H' Field Definition (Columns 19-23)
10.6 'P' Field Definition (Columns 24-25)
10.7 'G' Field Definition (Columns 26-27)
10.8 'LDA' Field Definition (Columns 31-72)
10.9 Continuation Records (Columns 4-72)
11.0 Subroutines
11.1 General
11.2 Subroutine Definition Operation Code 2
11.3 Subroutine CALL Records
Appendix

Specifies record formats describing printed board products providing sufficient detail on tooling, manufacturing and testing requirements. These formats may be used for transmitting information between the printed board designer and the manufacturing facility. The records are also useful when the manufacturing cycle includes computer aided processes and numerical control machines. The information can be used for both manual and for digital interpretation. Thus, each facility can produce a printed board product from the data by the most efficient method available. The data may be defined in either customary or metric units.

DevelopmentNote
This document is frozen; no future updates are planned. (03/2002) Also numbered as IEC 61182-1. (06/2002)
DocumentType
Standard
Pages
94
PublisherName
Institute of Printed Circuits
Status
Current

DSCC 11001 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
MIL-HDBK-59 Revision B:1994 COMPUTER AIDED ACQUISITION AND LOGISTIC SUPPORT (CALS) PROGRAM IMPLEMENTATION GUIDE
MIL-STD-1840 Revision C:1997 AUTOMATED INTERCHANGE OF TECHNICAL INFORMATION
DOD STD 100 : C NOTICE 6 ENGINEERING DRAWING PRACTICES
DSCC 11004 : 0 PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER
DSCC 11005 : 0 PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
IPC D 949 : 1987 RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR,
MIL-HDBK-288 Revision B:1991 REVIEW AND ACCEPTANCE OF ENGINEERING DRAWING PACKAGES
DSCC 11002 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
IPC D 355 : 0 PRINTED BOARD ASSEMBLY DESCRIPTION IN DIGITAL FORM
IPC D 352 : 0 ELECTRONIC DESIGN DATA DESCRIPTION FOR PRINTED BOARDS IN DIGITAL FORM
IPC D 354 : 0 LIBRARY FORMAT DESCRIPTION FOR PRINTED BOARDS IN DIGITAL FORM
DSCC 11003 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
MIL-STD-2118 Base Document:1984 FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR
IPC D 351 : 0 PRINTED BOARD DRAWINGS IN DIGITAL FORM
DSCC 10012 : 0 PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING
ASME Y14.24 : 2012 TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES
ASME Y14.100 : 2017 ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES
DSCC 10013 : 0 PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 3 WITH PLATED-THROUGH HOLES
DSCC 11006 : 0 PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING
DSCC 10014:2012 PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS

IPC D 354 : 0 LIBRARY FORMAT DESCRIPTION FOR PRINTED BOARDS IN DIGITAL FORM
IPC D 351 : 0 PRINTED BOARD DRAWINGS IN DIGITAL FORM
IPC D 352 : 0 ELECTRONIC DESIGN DATA DESCRIPTION FOR PRINTED BOARDS IN DIGITAL FORM

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