IPC DRM 18 : H2007

Terminology:
- Common Terms
- Polarity
- Orientation
- The Square Land/Pad
- Through-Hole Leads
- Surface Mount Leads
- Component Ref. Designator
- Common Class Letters
Through-Hole Axial & Radial:
- Capacitor (Non-Polarized)
- Capacitor (Polarized)
- Variable Capacitor
- Crystal
- Diode
- Light-Emitting Diode
- Filter
- Fuse
- Inductor
- Resistor
- Variable Resistor
- Switch
- Thermistor
- Transistor
- Voltage Regulator
Through-Hole IC's:
- SIP
- DIP
- IC Can
- PGA
Through-Hole Hardware:
- Connector
- Header
- Insulated Jumper
- Socket
Surface Mount:
CHIPs, MELFs & SOTs:
- Chip Components
- Molded Tantalum Capacitors
- MELF
- SOT
- DPAK
Surface Mount:
The SOIC Family:
- SOIC
- SO
- SOM
- SOL/SOW
- SOL-J
- VSOP
- SSOP
- QSOP
- TSOP
Surface Mount:
LCCs, QFPs, BGAs:
- LCC
- PLCC
- Flat Pack
- QFP (MQFP)
- PQFP
- BGA
Reading Component Bands:
- Reading Resistor Bands
- Reading a 4-Band Resistor
- Retma Color Code Chart-Resistor
- Reading a 5-Band Resistor
- Reading Capacitor Bands
- Retma Color Code Chart - Capacitor
- Reading Numbered Capacitors
- Reading Inductor Bands

Describes updated info on SSOP, TSOP, QFP, LQFP, PQFP, LCC, QFN, and BGA-related packages, including all the variations within those groups.