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  • IPC AJ 820 : A

    Current The latest, up-to-date edition.

    ASSEMBLY AND JOINING HANDBOOK

    Available format(s):  Hardcopy

    Language(s):  English

    Published date:  21-02-2012

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 HANDLING ELECTRONIC ASSEMBLIES
    3 DESIGN CONSIDERATIONS
    4 PRINTED CIRCUIT BOARDS
    5 ELECTRONIC CIRCUIT COMPONENTS
    6 SOLDERABILITY
    7 ASSEMBLY AND JOINING MATERIALS
    8 COMPONENT MOUNTING
    9 SOLDERING
    10 OTHER ASSEMBLY AND JOINING METHODS
    11 CLEANLINESS REQUIREMENTS
    12 CONFORMAL COATING
    13 POTTING AND ENCAPSULATION
    14 REWORK AND REPAIR

    Abstract - (Show below) - (Hide below)

    Specifies guidelines and supporting information for manufacturing electronic assemblies. The intent is to explain the 'how-to' and 'why' information, and fundamentals for these processes.

    General Product Information - (Show below) - (Hide below)

    Development Note Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC A 610 DANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 SPANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC S 815 : B1987 GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS
    IPC WHMA A 620 HUNGARIAN : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC A 610 ROMANIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC WHMA A 620 TURKISH : B2012 AMD 1 2013 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC WHMA A 620 HEBREW : B2012 AMD 1 2013 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC A 610 CZECH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 GERMAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 HINDI : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 ESTONIAN : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 POLISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC WHMA A 620 SPANISH : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC WHMA A 620 CHINESE : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC A 610 DUTCH : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC WHMA A 620 VIETNAMESE : B2012 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC A 610 KOREAN : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 ITALIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 FRENCH : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC A 610 SWEDISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 HUNGARIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC WHMA A 620 POLISH : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC A 610 CHINESE : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 TURKISH : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC A 610 JAPANESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 RUSSIAN : D ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 VIETNAMESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC WHMA A 620 KOREAN : B2012 AMD 1 2013 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC WHMA A 620 DANISH : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC J STD 609 : A MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
    IPC S 816 : 0 SMT PROCESS GUIDELINE AND CHECKLIST
    IPC HDBK 830 : A GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
    ASTM D 1458 : 2013-12 TEST METHODS FOR FULLY CURED SILICONE RUBBER-COATED GLASS FABRIC AND TAPES FOR ELECTRICAL INSULATION
    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC SM 780 : 0 COMPONENT PACKAGING AND INTERCONNECTING WITH EMPHASIS ON SURFACE MOUNTING
    ASTM D 3418 : 2015 : REDLINE Standard Test Method for Transition Temperatures and Enthalpies of Fusion and Crystallization of Polymers by Differential Scanning Calorimetry
    SAE AS 5553B : 2016 COUNTERFEIT ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS; AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION
    ASTM D 709 : 2017 : REDLINE Standard Specification for Laminated Thermosetting Materials
    SAE AS 6174 : 2014 COUNTERFEIT MATERIEL - ASSURING ACQUISITION OF AUTHENTIC AND CONFORMING MATERIEL
    IPC SM 784 : 0 GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION
    IEC 61086-2:2004 Coatings for loaded printed wire boards (conformal coatings) - Part 2: Methods of test
    ASME Y14.5 : 2009 DIMENSIONING AND TOLERANCING
    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    MIL-STD-1130 Revision C:2012 Connections, Electrical, Solderless Wrapped
    IPC DRM 18 : H2007 COMPONENT IDENTIFICATION TRAINING AND REFERENCE GUIDE
    IEC 61086-3-1:2004 Coatings for loaded printed wire boards (conformal coatings) - Part 3-1: Specifications for individual materials - Coatings for general purpose (Class 1), high reliability (Class 2) and aerospace (Class 3)
    IPC CC 830 : B QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
    ASTM E 595 : 2015 : REDLINE Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment
    IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    SAE AMS QQ N 290 : 2015 NICKEL PLATING (ELECTRODEPOSITED)
    MIL-STD-1686 Revision C:1995 ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)
    IPC D 422 : 0 DESIGN GUIDE FOR PRESS FIT RIGID PRINTED BOARD BACK PLANES
    ASTM D 571 : 1976 Methods of Testing Rubber Hose for Automotive Hydraulic Brake System (Withdrawn 1981)
    IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    MIL-HDBK-454 Revision B:2007 GENERAL GUIDELINES FOR ELECTRONIC EQUIPMENT
    IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
    IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC CM 770 : E COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS
    IPC J STD 012 : 0 IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY
    IPC CH 65 : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
    IPC J STD 005 : A REQUIREMENTS FOR SOLDERING PASTES
    IPC D 355 : 0 PRINTED BOARD ASSEMBLY DESCRIPTION IN DIGITAL FORM
    IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
    ESD S20.20 : 2014 PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)
    ASTM D 255 : 1992 Standard Method for Steam Distillation of Bituminous Protective Coatings (Withdrawn 2000)
    MIL-A-28870 Revision A:1990 ASSEMBLIES, ELECTRICAL BACKPLANE, PRINTED WIRING, GENERAL SPECIFICATION FOR
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC SM 839 : 0 PRE AND POST SOLDER MASK APPLICATION CLEANING GUIDELINES
    IPC 7094 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR FLIP CHIP AND DIE SIZE COMPONENTS
    IPC 1601 : 0 PRINTED BOARD HANDLING AND STORAGE GUIDELINES
    IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
    IPC 7711/21 : B REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
    IPC 2222 : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    ASTM D 4065 : 2012 : REDLINE Standard Practice for Plastics: Dynamic Mechanical Properties: Determination and Report of Procedures
    ASTM D 257 : 2014 : REDLINE Standard Test Methods for DC Resistance or Conductance of Insulating Materials
    IPC OI 645 : 0 STANDARD FOR VISUAL OPTICAL INSPECTION AIDS
    MIL-STD-202 Revision H:2015 ELECTRONIC AND ELECTRICAL COMPONENT PARTS
    IPC J STD 075 : 0 CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
    IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
    ASTM B 193 : 2016 : REDLINE Standard Test Method for Resistivity of Electrical Conductor Materials
    IPC SM 817 : A GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES
    ASTM D 570 : 1998 : R2018 Standard Test Method for Water Absorption of Plastics
    IPC DW 426 : 0 SPECIFICATIONS FOR ASSEMBLY OF DISCRETE WIRING
    IPC 2223 : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
    ASTM D 2214 : 2002 Standard Test Method for Estimating the Thermal Conductivity of Leather with the Cenco-Fitch Apparatus (Withdrawn 2008)
    IPC C 406 : 0 DESIGN AND APPLICATION GUIDELINES FOR SURFACE MOUNT CONNECTORS
    ASTM D 3359 : 2017 : REDLINE Standard Test Methods for Rating Adhesion by Tape Test
    IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
    ASTM D 638 : 2014 : REDLINE Standard Test Method for Tensile Properties of Plastics
    IPC 9191 : 0 GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
    ASTM F 1249 : 2013 : REDLINE Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and Sheeting Using a Modulated Infrared Sensor
    IPC FA 251 : 0 GUIDELINES FOR ASSEMBLY OF SINGLE- AND DOUBLE-SIDED FLEX CIRCUITS
    IPC SM 785 : 0 GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS
    IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    ASTM E 92 : 2017 : REDLINE Standard Test Methods for Vickers Hardness and Knoop Hardness of Metallic Materials
    IEC 61086-1:2004 Coatings for loaded printed wire boards (conformal coatings) - Part 1: Definitions, classification and general requirements
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