IPC EM 782 : 1996
Withdrawn
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD SPREADSHEET
Published date
12-01-2013
Publisher
Withdrawn date
23-07-2013
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Provides appropriate size, shape and manufacturing tolerance of lands to ensure sufficient area for the formation of solder fillets, as described in IPC/EIA J-STD-001, which provide optimum electrical connections and permit inspection and test. Each component package and corresponding land pattern has been registered with a unique number. The land patterns accommodate all three performance classifications.
| DocumentType |
Standard
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
| IPC A 28 : LATEST | SMT ASSEMBLY BENCHMARK ARTWORK |
| IPC A 49 : LATEST | SURFACE MOUNT LAND PATTERN ROUND ROBIN ARTWORK - FILM FORMAT |
| IPC SM 782 : A1993 AMD 2 1999 | SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC SM 782 : A1993 AMD 2 1999 | SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
Summarise
Sorry this product is not available in your region.