IPC HDBK 4691 : 2015
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
HANDBOOK ON ADHESIVE BONDING IN ELECTRONIC ASSEMBLY OPERATIONS
15-08-2022
01-12-2015
1 SCOPE
2 APPLICABLE DOCUMENTS
4 ADHESIVE CHEMISTRIES
5 DISCUSSION OF MECHANICAL PROPERTIES
6 DISCUSSION OF THERMAL PROPERTIES
AND TEST METHODS
7 DISCUSSION OF ELECTRICAL PROPERTIES
8 PHYSICAL PROPERTIES
9 DESIGN CONSIDERATIONS AND END-USE
ENVIRONMENT
10 LONG-TERM RELIABILITY AND TESTING
11 MANUFACTURING/EQUIPMENT
CONSIDERATIONS
12 PREPARATION FOR ADHESIVE BONDING
13 APPLICATION PROCESS MONITORING
14 REWORK AND REPAIR PROCESSES
15 ENVIRONMENTAL, HEALTH AND SAFETY
CONSIDERATIONS
16 LEAD-FREE PROCESSING THAT AFFECTS
ADHESIVE BONDING
17 ENVIRONMENTAL REGULATIONS
Describes the initial version of this document, the discussion of adhesives will be limited to liquid, paste and gel materials and closely related film adhesives, which require some form of cure mechanism to achieve their full performance.
| DevelopmentNote |
Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
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