IPC HDBK 4691 : 2015

Current

Current The latest, up-to-date edition.

HANDBOOK ON ADHESIVE BONDING IN ELECTRONIC ASSEMBLY OPERATIONS

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Published date: 01-12-2015

Publisher: Institute of Printed Circuits

Table of Contents - (Show below) - (Hide below)

1 SCOPE
2 APPLICABLE DOCUMENTS
4 ADHESIVE CHEMISTRIES
5 DISCUSSION OF MECHANICAL PROPERTIES
6 DISCUSSION OF THERMAL PROPERTIES
   AND TEST METHODS
7 DISCUSSION OF ELECTRICAL PROPERTIES
8 PHYSICAL PROPERTIES
9 DESIGN CONSIDERATIONS AND END-USE
   ENVIRONMENT
10 LONG-TERM RELIABILITY AND TESTING
11 MANUFACTURING/EQUIPMENT
   CONSIDERATIONS
12 PREPARATION FOR ADHESIVE BONDING
13 APPLICATION PROCESS MONITORING
14 REWORK AND REPAIR PROCESSES
15 ENVIRONMENTAL, HEALTH AND SAFETY
   CONSIDERATIONS
16 LEAD-FREE PROCESSING THAT AFFECTS
   ADHESIVE BONDING
17 ENVIRONMENTAL REGULATIONS

Abstract - (Show below) - (Hide below)

Describes the initial version of this document, the discussion of adhesives will be limited to liquid, paste and gel materials and closely related film adhesives, which require some form of cure mechanism to achieve their full performance.

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Development Note	Also available in Hardcopy format. (01/2018)
Document Type	Standard
ISBN
Pages
Published
Publisher	Institute of Printed Circuits
Status	Current

Standards Referencing This Book - (Show below) - (Hide below)

IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC TM 650 : 0	TEST METHODS MANUAL
IPC CH 65 : B	GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES

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