IPC-J-STD-003D:2023
Current
Current
The latest, up-to-date edition.
Solderability Tests for Printed Boards
Available format(s)
Hardcopy
Language(s)
Chinese, English
Published date
13-01-2023
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.The IPC J-STD-003D standard describes solderability determinations that are made to verify that the printed board fabrication processes and subsequent storage have had no adverse effect on the solderability of those portions of the printed board intended to be soldered.
| DocumentType |
Standard
|
| Pages |
44
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
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