IPC J STD 003 : C

1 GENERAL
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 TEST PROCEDURES
5 EVALUATION AIDS
6 NOTES
APPENDIX A - Calculation of Maximum Theoretical Force for
             a Rectangular Cross-Section
APPENDIX B - Calculation of Area Under the Wetting Curve
APPENDIX C - Informative Annex
APPENDIX D - Test Protocol for Wetting Balance Gauge
             Repeatability and Reproducibility (GR & R)
             Using Copper Foil Coupons
APPENDIX E - J-STD-002/J-STD-003 Activated Solderability
             Test Flux Rationale Committee Letter

Describes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes (PTHs).