IPC JEDEC-9704A:2012

This document is meant to be used as a methodology for strain gage placement and subsequent testing of Printed Circuit Assemblies (PCAs) using strain gages. The method describes specific guidelines for strain gage testing of PCAs during the printed board manufacturing process, including assembly, test, system integration, and other types of operations that may induce board flexure. The suggested procedure enables printed board assemblers to conduct strain gage testing independently, and provides a quantitative method for measuring board flexure, and assessing risk levels. The topics covered include: • Test setup and equipment requirements • Strain measurement • Report format This document assumes the methodology is being used to test a surface mount device such as Ball Grid Array (BGA), Small Outline Package (SOP), Chip Scale (Size) Package (CSP), and area-array surface mount (SMT) connectors/sockets. In certain cases, the described test approach may be used for non-area-array discrete (SMT) devices such as capacitors or resistors.