JEDEC JESD 22-B113B:2018
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-08-2018
Publisher
Superseded date
24-12-2025
Superseded by
Free
Excluding VAT
The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of SMT ICs in an accelerated test environment for handheld electronic products applications.
| Committee |
JC-14.1
|
| DocumentType |
Test Method
|
| Pages |
26
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IPC JEDEC-9704A:2012 | Printed Circuit Assembly Strain Gage Test Guideline |
| IPC-9701B:2022 | Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments |
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