IPC/JEDEC J-STD-033D:2018
Current
Current
The latest, up-to-date edition.
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
Available format(s)
Hardcopy , PDF
Language(s)
Japanese, Spanish, Castilian
Published date
01-03-2018
Publisher
Excluding VAT
This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices and other moisture sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air.
| DocumentType |
Standard
|
| ISBN |
978-1-61193-348-2
|
| Pages |
32
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
| JEDEC JEP113-B:1999 | SYMBOL AND LABELS FOR MOISTURE-SENSITIVE DEVICES |
Summarise