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IPC J STD 033C-1:2014

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES

Available format(s)

Hardcopy

Superseded date

21-09-2023

Language(s)

English

Published date

01-08-2014

1 FOREWORD
2 APPLICABLE DOCUMENTS (Normative)
3 DRY PACKING
4 DRYING
5 USE
6 BOARD REWORK
7 DERATING DUE TO FACTORY
  ENVIRONMENTAL CONDITIONS
APPENDIX A - Test Method for Reversible
             (Type 1) RH Spots on a
             Humidity Indictor Card (HIC)
             used with Electronic Device
             Packaging
APPENDIX B - Derivation of Bake Tables
APPENDIX C - Desiccant Unit Absorption
             Capacity Test Method for
             Verification
APPENDIX D - Changes in J-STD-033D

Gives manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075.

Committee
JC-14.1
DevelopmentNote
Supersedes IPC SM 786 & EIA JEP 124. B.1 2007 Edition is still available in Russian and Italian Languages, See separate records. (02/2012) C2012 Edition is still available in Hungarian, German & Chinese Languages, See separate records. (10/2014) Jointly Published by IPC and JEDEC. (05/2016)
DocumentType
Standard
Pages
28
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

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DD IEC PAS 62647-23 : DRAFT AUG 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
ES 59008-5-3 : 2001 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 5-3: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - MINIMALLY-PACKAGED DIE
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BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices General
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BS EN 60749-20-1:2009 Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
12/30261600 DC : DRAFT MAR 2012 BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
BS EN 61760-4 : 2015 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
I.S. EN 61760-4:2015 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
I.S. EN 60749-20-1:2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
CEI EN 62258-2 : 2012 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
CEI EN 62258-1 : 2011 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
EN 62258-2:2011 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
IPC 1601 CHINESE : 2016 PRINTED BOARD HANDLING AND STORAGE GUIDELINES

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